PCBs with Embedded Copper Coin

Dissipating heat through a PCB can be done with thermal vias or MCPCB but sometimes thermal vias are not sufficient and MCPCB is not an option due to layer count. That is where press fit Copper Coin can be the solution

Basically it is based on getting a copper coin press fit into a premade cutout in the board right under an area that is identified as a hot spot – MOSFET pad for example.

1.Stack-up & Process Flow

Stack-up Suggestion

stackup-Copper Coin

2. Process Flow

Process Flow-Copper Coin

3. Process Capability

ITEM PROCESS                CAPABILITY
Layer normal：  4L－6L

Special：  2L & 8L
Min. Shipping Size 50mm×75mm
Final Copper Thickness Outer Layer：Hoz+plating,1oz+plating,2oz+plating

Inner Layer：Hoz,1oz,2oz,3oz
Final Board Thickness <1.00mm  Tolerance:+/-0.1mm
≥1.00mm  Tolerance:+/-10%

 

4. Process Capability

ITEM PROCESS      CAPABILITY
Cu Coin Size 5mm*5mm—80mm*80mm
Cu Coin Thickness 1.0—2.5mm,
Cu Coin Shape lCylinder or Cube/Cuboid (with radius)

lMust be solid without hole
Cu Coin Dimension Tolerance X/Y axis：+/-50um
Height Tolerance of Cu coin Vs. FR4 board +/-30um
Cu Coin to Inner Layer Circuit min：0.30mm
Cu Coin to PTH Min:  0.40mm
Cu Coin to NPTH Min:  0.30mm
Cu Coin to Outline Min:  0.70mm

5. Key Points Control

Key Points Control Control Method
Cu Coin Inlay Location Stability •In order to easily put Cu coin into FR4 window opening. FR4 window opening size must be controlled. During lamination process epoxy resin will fill the gap between FR4 and Cu coin, Cu coin size shall be 0.075mm (single side) smaller than FR4 window opening.
Cu Inlay Vs. FR4 Planarity Tolerances •Carefully measure Cu coin inlay thickness. +/- 1mil

•FR4 board thickness and Cu coin inlay thickness must be compatible.

•The height tolerance of FR4 Vs. Cu coin inlay must be less than 30um.

Sample: Copper Coin Inlay

Layer Count：6L
Board Thickness：1.50±0.20mm
Cu Coin Size：20mm*10mm*1.50mm
Surface Finish：I-Tin
Key Technology：copper coin inlay

6L

 

Sample:3L Copper Coin Inlay Board with Depth Control Blind Routing ‏

3L-Copper coin

 

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