PRODUCTION CAPABILITY

Certifications

ISO 9001:2008

Yes

TS 16949

Yes

ISO 14001

Yes

RoHS Compliant

Yes

Other

Yes

Surface Finishes

HASL

3-25 um

HASL-Lead free

3-25 um

Immersion Tin

0,80-1,20 um

Immersion Silver

0,12-0,38 um

ENIG (immersion gold)

Ni:2-3,75 um,0,05-1,20 um

OSP

Electrolytic Hard Gold (Au thickness)

0,025-1,27 um

Electrolytic Soft Gold (Au thickness)

0,025-1,20 um

Electrolytic Gold For Wire Bond

0,38-0,75 um

Selective Finishes (More than one finish) 

ENIG + OSP /  HASL+Gold finger / ENEPIG

Copper thickness

0.5-6 oz

Yes

Other

Specail 28 oz

Layers & Board thickness

Single sided

0,1-8,0 mm

Double sided

0,2-8,0 mm

Multilayer

0,4-6,0 mm

4 – 6 layer

0,4-6,0 mm

8 –12 layer

1-6 mm

Over 12 layer

1,4-6,0 mm

Max.layer count-Flex

8

Max.layer count-Rigid / Flex

8

Material Types

FR-4 / FR4 (170) / FR4 (180

Yes

Flex

Yes

Rigid / Flex

Yes

Teflon

F4B,Rogers,Taconic;Arlon

Ceramic

Rogers

Polyimide

yes

Hybrid

Rogers+FR-4;PTFE+FR-4

Aluminum

Bergquist & Poyltronics , others

Minimum Line Width and Spacing

3mil

Yes

Minimum Drilled Hole Size

Laser drilling

4 mil

CNC Drill

8 mil

Minimum Tolerances

PTH

+/-0,05 mm

NPTH

+/-0,05 mm

Outline-routed

+/-0,10 mm

Outline-scored

+/-0,15 mm

Scoring

20°, 30°, 45°, 60°

Yes

Jump Scoring

Yes

Soldermask

Colors available

Green, Black, White, Blue, Yellow, Red

Legend Print/Silkscreen

Colors available

White, Yellow , Black , Red , Blue , Pink

Additional Process Capabilities

Peelable Mask

Yes

Max.diameter to tent with peelable mask

3,0 mm

Max.peelable mask thickness

0,40 mm

Via hole filler soldermask (100% fill)

Yes

Via hole filler soldermask max.hole diameter

0,60 mm

Conductive Hole Filler (Silver/Copper)

Yes

Carbon Ink minimum spacing

0,15 mm

Half-hole plating

Yes

Edge Plating

Yes

Min.hole wall plating thickness

25 um

Countersinks

90°

Bevelling

20°, 30°, 45°, 60°

Controlled depth routing

Yes

Hard Gold Finger (Gold thickness)

0,025 – 1,27 um

Blind Via Construction

Yes

Buried Via Construction

Yes

Via in pad

Yes

Controlled Impedance

Yes

Unique Technologies

  • Embedded Copper Coin
  • Bendable Aluminum boards
  • Mirror Aluminum
  • Long boards up to 47″
    (Single sided NPTH & doublesided PTH )
  • Hybrid (Rogers + FR-4, PTFE + FR-4)
  • High reflective Aluminum
  • Concave cup
  • Pedestal (Copper base)
  • Screw hole tapping
  • Countersink hole
  • Anodic treatment