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PCBs with Embedded Copper Coin
Dissipating heat through a PCB can be done with thermal vias or MCPCB but sometimes thermal vias are not sufficient and MCPCB is not an option due to layer count. That is where press fit Copper Coin can be the solution
Basically it is based on getting a copper coin press fit into a premade cutout in the board right under an area that is identified as a hot spot – MOSFET pad for example.
1.Stack-up & Process Flow
Stack-up Suggestion
2. Process Flow
3. Process Capability
| ITEM | PROCESS CAPABILITY |
| Layer | normal： 4L－6L
Special： 2L & 8L |
| Min. Shipping Size | 50mm×75mm |
| Final Copper Thickness | Outer Layer：Hoz+plating,1oz+plating,2oz+plating
Inner Layer：Hoz,1oz,2oz,3oz |
| Final Board Thickness | <1.00mm Tolerance:+/-0.1mm ≥1.00mm Tolerance:+/-10% |
4. Process Capability
| ITEM | PROCESS CAPABILITY |
| Cu Coin Size | 5mm*5mm—80mm*80mm |
| Cu Coin Thickness | 1.0—2.5mm, |
| Cu Coin Shape | lCylinder or Cube/Cuboid (with radius)
lMust be solid without hole |
| Cu Coin Dimension Tolerance | X/Y axis：+/-50um |
| Height Tolerance of Cu coin Vs. FR4 board | +/-30um |
| Cu Coin to Inner Layer Circuit | min：0.30mm |
| Cu Coin to PTH | Min: 0.40mm |
| Cu Coin to NPTH | Min: 0.30mm |
| Cu Coin to Outline | Min: 0.70mm |
5. Key Points Control
| Key Points Control | Control Method |
| Cu Coin Inlay Location Stability | •In order to easily put Cu coin into FR4 window opening. FR4 window opening size must be controlled. During lamination process epoxy resin will fill the gap between FR4 and Cu coin, Cu coin size shall be 0.075mm (single side) smaller than FR4 window opening. |
| Cu Inlay Vs. FR4 Planarity Tolerances | •Carefully measure Cu coin inlay thickness. +/- 1mil
•FR4 board thickness and Cu coin inlay thickness must be compatible. •The height tolerance of FR4 Vs. Cu coin inlay must be less than 30um. |
Sample: Copper Coin Inlay
Layer Count：6L
Board Thickness：1.50±0.20mm
Cu Coin Size：20mm*10mm*1.50mm
Surface Finish：I-Tin
Key Technology：copper coin inlay
Sample:3L Copper Coin Inlay Board with Depth Control Blind Routing
