High-Performance Flex PCBs
Built for Innovation, Designed for Reliability
Flex PCBs are engineered for dynamic applications where space, weight, and movement constraints demand superior design flexibility. At HT Global Circuits, we understand that today’s electronic systems demand more than just performance; they require design freedom, reliability under stress, and space-saving innovation. That’s where our Flex Printed Circuit Boards (FPCBs) come in.
Our advanced flex PCB fabrication equipment supports complex geometries, bendable configurations, and lightweight performance without compromising electrical reliability. Our solutions are customized to meet diverse mechanical and electrical requirements, where flexibility is a key characteristic, such as in medical devices, the automotive industry, aerospace, and wearable electronics. As a trusted flexible PCB manufacturer, we provide end-to-end services for custom flex circuit boards.
Flexible PCBs Capabilities
We offer custom rigid PCBs with exceptional flexibility in terms of layers, materials, dimensional stability, and many other features.
Here are some of the technical capabilities.
| Specification | Capability |
|---|---|
|
Layer Count
|
Single‑layer up to multilayer flex and rigid‑flex PCBs (flex up to 10 layers) |
|
Board Thickness |
Flex board thickness scalable across a broad range (e.g. 0.003″–0.236″ per directory data) |
|
Substrate Materials |
Polyimide and polyester |
|
Copper Foil & Weight |
Fine-line copper suitable for flexible circuits; supports standard copper foil options (e.g. 0.5 oz – 2 oz). Finished copper weights- 18µm – 70µm |
|
Impedance Control |
Precision impedance control available for high-density routing on flex and rigid-flex boards |
|
Flex Options & Cover lays
|
Single- and double-sided flex; rigid‑flex; PI or PET cover-lay layers; sensor-style flex geometries
|
|
Minimum Trace/Space |
2.4/3.0 mils- Enables high-resolution designs with tight trace/space tolerances suitable for HDI flex
|
|
Manufacturing Volume & Turn-Times |
Quick-turn prototyping to medium/high-volume manufacturing with offshore support and lead-times as low as 1–10 days
|
|
DFM & Engineering Support
|
Dedicated engineering and DFM reviews for flexible board layout, bend zones, stiffener integration
|
|
Surface finishes |
OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
|
|
Minimum drill |
4.0 mils |
|
Certifications & Industry Compliance |
ITAR‑compliant fabrication; ISO, UL, IATF 16949, AS9100 certifications for aerospace/automotive flex PCBs
|
|
Special processes |
Counter sink, Edge platting, Bonding, Castelated holes, Carbon ink, Peelable solder mask |
Certifications
Our production facilities produce in accordance with the IPC-A-600, IPC 6011 and IPC 6012 standards and have been awarded all the key certificates:
Beneficial Features of Flex PCBs
Our flex PCBs are engineered to provide mechanical adaptability, electrical reliability, and space-saving advantages for compact and dynamic electronic designs. They are perfect for tight spaces, weight-sensitive, and mission-critical applications. Whether you’re designing for the curved interior of a medical device, the high-vibration environment of an aerospace system, or the ultra-compact structure of consumer electronics, HTGC’s FPCBs deliver precision and performance. Below are the key features of our custom flex PCBs.
Bendable and Form-Fitting Design
Our flexible circuit boards conform to tight spaces and dynamic movements without sacrificing performance. They can be bent, folded, or twisted to fit into mechanical structures, enabling 3D packaging and lightweight assemblies in complex enclosures.
Thin, Lightweight Construction
HT Global Circuit’s flex PCBs are manufactured with ultra-thin substrates such as polyimide, significantly reducing weight and volume compared to rigid PCBs. This makes them ideal for aerospace, medical, and wearable applications where miniaturization and portability are critical.
Enhanced Reliability Under Stress
Designed to withstand repetitive flexing, vibration, and harsh environments, our custom flexible PCBs offer improved durability over traditional wire harnesses or connectors. Reinforced bend areas and controlled trace routing prevent cracking and signal failure during movement.
Single & Multilayer Flex Options
We offer both single-layer and multilayer flex PCB board configurations, supporting high-density interconnects, impedance-controlled lines, and embedded passive elements.
Thermal Management & Heat Dissipation
Our flexible PCBs incorporate thermally stable materials such as polyimide, which maintain integrity across wide temperature ranges. Copper planes and optimized layer structures improve heat dissipation for power-dense and high-performance systems.
Design Versatility & Component Integration
Flex layouts allow for creative component placement and the integration of sensors, connectors, and shielding within a single compact design. We support stiffeners, adhesive bonding, and ZIF connector designs to enhance mechanical support and functionality.
Reduced Assembly Complexity
By replacing multiple rigid boards and connectors with a single flexible PCB, we help OEMs reduce part count, simplify installation, and improve signal integrity across interconnects. This leads to streamlined production and enhanced system reliability.
Key Industries and Applications
We offer flexible PCB solutions tailored to the needs of OEMs and contract manufacturers across demanding, innovation-driven sectors.
Below are the key industries and applications in which our custom flexible PCBs are utilized.
- Aerospace & defense: Used in avionics, satellite systems, and military-grade electronics, our ITAR-compliant flexible PCBs withstand extreme environments, vibration, and tight enclosures while meeting stringent reliability and weight specifications.
- Automotive electronics: Ideal for infotainment systems, sensors, lighting controls, and EV battery management, our flexible PCBs are resistant to heat, moisture, vibration, and continuous motion.
- Medical devices: From diagnostic imaging to wearable health monitors and implantable devices, our flexible PCBs enable miniaturized, biocompatible designs with high reliability under continuous use.
- Consumer & wearable technology: Used in smartwatches, fitness bands, AR/VR headsets, and foldable devices, flexible PCBs support compact and ergonomic designs that require repeated bending and tight curvature routing.
- Industrial controls & robotics: For applications involving repetitive movement and space constraints, such as robotic arms and automation systems, our flexible PCB fabrication ensures long-term mechanical resilience and efficient interconnects.
- Telecommunications & networking: In network modules and RF communication devices, flexible PCBs allow for compact multilayer routing, EMI shielding, and improved signal integrity in limited space.
- High-power electronics: Used in power conversion modules, inverters, and compact power supplies, our flexible PCBs offer efficient thermal performance and mechanical flexibility for high-density electrical systems.
Why Do Engineers Choose HT Global for Flex PCBs?
OEMs trust our technical expertise, advanced equipment, and rigorous quality control processes.
Our engineering-focused approach ensures consistent electrical performance while meeting the clients’ timeframes and budgets.
- Material Expertise: Our excellent vendor network ensures we get the best materials for flexible PCBs, such as polyimide and polyester of the required quality and thickness. We offer guidance on selection to balance electrical performance with thermal management and mechanical requirements.
- Controlled Impedance Precision: We use advanced test equipment to achieve impedance measurement accuracy within ±1 ohm for 50-ohm systems. Our TDR analysis validates impedance profiles along trace lengths, identifying any discontinuities. We also conduct temperature coefficient testing to guarantee stable impedance across operational temperature ranges.
- Plated Through-Hole Quality: We ensure copper plating uniformity to maintain impedance consistency through via transitions, with less than 1% variation. We also offer filled options that eliminate air gaps, preventing thermal cycling issues.
Get your PCBs Built – Fast
HT Global Circuits delivers quick-turn, high-quality PCBs with transparent pricing and reliable delivery. Order now to keep your projects on track.
Frequently Asked Questions
Flexible circuits typically use polyimide or polyester (PET) films as the base substrate. Copper is used for the conductive layer, while cover-lays made of polyimide or solder mask protect the circuitry. Adhesives or adhesive-less constructions are selected based on thermal and mechanical requirements.
A common guideline is a minimum bend radius of 10× the material thickness for dynamic flex and 6× for static bends. For example, a 0.005″ thick flex layer would require a 0.050″ minimum radius in dynamic applications to avoid stress cracking.
Yes, HT Global Circuits manufactures multilayer flexible PCBs with up to 10 layers, depending on design complexity. We also produce rigid-flex configurations that integrate multiple flexible layers with rigid sections for high-density and mechanically demanding applications.
Yes. Controlled impedance can be implemented by carefully managing trace width, spacing, and dielectric thickness on flex layers. We support impedance modeling and DFM review to ensure proper signal performance in high-speed or RF flexible circuit designs.
Absolutely. We support stiffeners made of FR4, polyimide, or stainless steel for mechanical reinforcement, as well as gold finger plating and ZIF-compatible pads for connector interfaces in custom flexible PCB assemblies.
We optimize designs for flex endurance by material selection: High-performance polyimide (e.g., DuPont™ Pyralux®) with >50,000 bend cycles. Reinforcement: Strategic stiffener placement to isolate critical components from stress points.
Adhesive-less flex circuits (e.g., “2-layer no-flow” designs) offer:
- Thinner profiles: Up to 30% reduction in thickness vs. adhesive-based flex.
- Better thermal performance: No adhesive degradation at high temps (>200°C).
- Higher reliability: Eliminates delamination risks in dynamic bending.