HDI PCBs
Built for Innovation, Designed for Reliability
A high-density interconnect board has a higher wiring density per unit area than standard boards. This allows for the placement of a greater number of components in the available space and hence these boards are suitable for compact devices. These boards comprise minor vias, capture pads, finer spaces and lines, and higher connection pad density, which help keep the device small and lightweight. HDI PCBs are known to increase the electrical performance of the device.
As one of the known and reliable PCB manufacturers, at HT Global Circuits, we offer custom HDI PCB manufacturing and assembly with stringent testing and inspection processes, designed especially for high-density, high-frequency applications.
HDI PCB Capabilities
HDI PCBs are one of the advanced capabilities we have and you can totally rely on our engineering depth, yield optimization, and DFM support for HDI builds. We offer multilayer HDI PCB design support and our HDI PCBs are of IPC Class 2/3 quality. Below are our HDI PCB capabilities along with their technical specifications.
| Specification | Capability |
|---|---|
|
Materials |
High-performance materials (RO4350, Bergquist HT, MEG6) |
|
Layer Count
|
4-24 layers |
|
Minimum dielectric thickness |
Standard- 0.05mm
Advanced- 0.025mm
|
|
Minimum trace width & space |
2.5 mil / 2.5 mil line & space |
|
HDI/Buried, stacked, and blind vias |
1+n+1, 2+n+2, 3+n+3, 4+n+4, 5+n+5, ELIC |
|
Maximum PCB thickness |
0.2mm-8mm (8-320 mil) |
|
Maximum board size
|
1105mm x 610mm (44″x24″) |
|
Surface finishes |
ENIG, Immersion Silver, OSP, Lead-free HASL |
|
Minimum drill hole size |
Laser- 0.10mm
4 mil
CNC- 0.15mm
4 6mil
|
|
Cutting-edge technical capabilities |
HDI, micro-via, via-in-pad, flex, and metal core |
|
Controlled impedance |
Tight tolerances (±5%) |
|
Fine lines and spaces |
≤ 100 µm / 0.10mm |
|
Small vias and capture pads |
(<150 µm) and capture pads <400 µm / 0.40mm |
|
Higher connection pad density |
>20 pads/cm2 |
|
Scalability |
Prototype to production scalability |
|
Quality Certifications |
ISO 9001:2015, ISO 14001, ISO 45001, IATF 16949:2016 Certified, IPC-6012DA, ISO 13485 |
|
Industry-specific certifications |
TS 16949
AS9100 (TBD)
MIL-PRF-31032 (TBD)
ISO 13485
|
|
Material certifications |
RoHS
UL 94V-0
UL-C
UL ZPMV2
|
|
HDI PCB fabrication capabilities: |
Line/space: down to 2.5/2.5 mil
Via types: Laser drilled, stacked, staggered, skip vias
|
Certifications
Our production facilities produce in accordance with the IPC-A-600, IPC 6011 and IPC 6012 standards and have been awarded all the key certificates:
Common HDI Stackups & Design Support We Offer
We offer comprehensive design support for HDI PCBs, helping engineers optimize their layouts for high performance, reliability, and manufacturability. We help designers optimize their layouts.
- Common HDI stackups: These are categorized based on the number of signal and power/ground layers. For instance, a 1+N+1 stack-up consists of a single core layer N, with one micro via layer on the top and bottom side. These are used for low to mid-range complexity designs where high-density routing is required. Additionally, 2+N+2 stack-up includes N core layers and Micro-via layers on the outer layers. The outer layers carry signals, power, and ground, enabling more complex routing and improved electrical performance.
- Support for sequential lamination: We offer sequential lamination, a process that builds multilayer HDI boards by adding layers one at a time. This approach ensures precise alignment and superior layer registration for high-performance circuit boards.
- DFM and impedance modeling: We conduct comprehensive DFM reviews for HDI PCB designs to minimize rework and manufacturing defects. We offer impedance modeling services to ensure that the PCB’s traces are properly sized and spaced, which is necessary in high-speed signal applications.
- Via-in-pad design support: We help engineers create better routing efficiency and optimized board space through our via-in-pad design support. This ensures the designs are robust and manufacturable.
- Signal integrity reviews: We offer signal integrity reviews for high-speed designs which prevent signal losses and distortion in high-frequency applications. We evaluate the routing of traces, via placements, layer stack-ups, and other factors to optimize high-speed designs. We use advanced simulation tools and time-domain reflectometry (TDR) for in-depth analysis of signal integrity.
Beneficial Features of HDI PCBs
HDI circuit boards are largely beneficial as they enable miniaturization of devices while retaining complex designs and functionalities, and offer better signal integrity and higher routing density. High-density interconnect boards have finer lines, laser microvias, and advanced layer stacking. Here are some beneficial features of HDI PCBs in modern electronics.
Miniaturization without compromising performance
HDI circuit boards enable the creation of small-form factor assemblies and in turn devices, which is crucial in modern electronics. They are space-efficient owing to finer traces, microvias, and higher layer densities, among other features, which allows for more functionality in a smaller footprint and helps make the devices portable and lightweight. Despite the miniature size, their electrical performance is superior.
Improved electrical performance (shorter signal paths)
The densely designed shorter signal paths imply reduced signal losses and degradation, which is absolutely crucial in high-speed, high-frequency applications. HDI boards offer improved impedance control and signal integrity owing to the closely routed traces. This also helps reduce EMI and crosstalk.
Better power distribution and thermal performance
HDI circuit boards feature optimized power and ground planes, enabling the efficient distribution of power to various components, which is essential for devices with high power requirements. HDI PCBs offer improved heat dissipation, and their design flexibility allows for better integration of heat sinks, vias, and so on, which facilitates superior thermal management.
Lower layer count (cost savings in many cases)
While businesses may invest initially in HDI PCBs, they prove to be cost-effective in the long run. The materials used are relatively few and of superior quality which is beneficial for businesses and the environment.
Enhanced reliability through sequential lamination
The use of sequential lamination in HDI PCBs creates strong bonds between layers, ensuring that the board maintains its structural integrity even under high stress or thermal cycling. It also allows for precise alignment of layers which increases the reliability of the board. These boards are designed to be resistant to mechanical stresses, thermal expansion, and vibration, making them durable and reliable even in demanding environments.
Key Industries and Applications
Key Industries and Applications
Our HDI PCBs are employed in mission-critical and high-frequency applications. As an experienced HDI PCB manufacturer, we worked with leading OEM’s across these industrial sectors to support these requirements
- Consumer electronics: Here, HDI boards are utilized in smartphones, laptops, tablets, and wearables, and other small, powerful devices with complex functions such as processors, wireless communication, and camera modules.
- Automotive: HDI PCBs are used in ADAS, which requires high-speed data transmission and compact, reliable boards for sensors, cameras, radar, and LIDAR systems. They also find use in electric vehicles (EVs) and infotainment systems.
- Telecom: They are utilized in 5G base stations, routers, and communication modules, and in mobile phones and network equipment for high-speed data transfer. These boards also find use in wireless devices such as routers and Bluetooth equipment.
- Medical: Here, these boards are used in portable ECGs, blood glucose monitors, and pulse oximeters, implantable devices such as pacemakers and neurostimulators, and imaging equipment such as MRI machines, ultrasound equipment, and X-ray systems.
- Aerospace and defense: HDI PCBs are used in satellite communication systems and space-grade electronics. In the defense sector, they find use in radar systems, missile guidance systems, and electronic warfare devices. In avionics, HDI boards are used in navigation and communication systems in aircraft.
- Industrial automation: Here, HDI PCBs find application in robotics, control systems, motor drivers, sensors, and communication interfaces in industrial automation systems. They also find use in power management systems such as inverters, converters, and UPS.
- Internet of Things (IoT): These boards are used in industrial IoT sensors, controllers, and communication modules and smart home devices such as smart thermostats, lights, and security cameras.
Why Do Engineers Choose HT Global Circuits?
High-performance PCB solutions for aerospace, automotive, medical, telecom, and industrial sectors. Here are some reasons why OEMs prefer to partner with us for their HDI PCB requirements.
- Advanced manufacturing techniques: Many of our clients have experienced the benefits of our HDI PCBs with stacked microvias, via-in-pad, and fine-pitch BGA support. We use advanced manufacturing techniques, such as stacked microvias and via-in-pad designs.
- DFM reviews specific to HDI complexity: We emphasize DFM reviews specially tailored to HDI designs to ensure meeting the required specification and reducing errors. Our experienced team of engineers offers design insights and optimizations that help address potential issues related to layer count, micro-via routing, and signal integrity.
- Tight registration and laser drill accuracy: Fine-pitch designs require tight registration and laser drill accuracy. We offer precision in drilling microvias and alignment.
- Cleanroom processing and AOI for sub-75µm features: We use cleanroom processing for HDI PCBs to eliminate the possibility of contamination. We use AOI to detect issues, such as incorrectly placed components, among others.
- Global production and certifications: We offer HDI PCBs worldwide and hold certifications for ISO 9001, IATF 16949, and IPC Class 3. While ISO 9001 ensures adherence to global standards for quality management systems, IATF 16949 is an automotive-specific standard. IPC Class 3 is the highest standard for the manufacturing of PCBs used in demanding applications.
Get your PCBs Built – Fast
HT Global Circuits delivers quick-turn, high-quality PCBs with transparent pricing and reliable delivery. Order now to keep your projects on track.
Frequently Asked Questions
Here are the different types of vias used in HDI PCBs.
- Microvias: Small vias with a diameter of less than 150 microns used in HDI designs for high-density routing.
- Blind Vias: Vias that connect the outer layers to inner layers without passing through the entire board.
- Buried Vias: Vias that connect only inner layers and do not reach the outer layers of the PCB.
- Stacked Vias: Multiple vias that are stacked on top of one another to connect multiple layers in high-density designs.
Stacked microvias enable more efficient routing and improved space utilization by stacking multiple vias in a vertical orientation. This enables designers to create more complex, high-density interconnections in a compact space, reducing the PCB’s size and layer count while maintaining performance.
The manufacturing of HDI PCBs comprises these advanced processes.
- Laser drilling: Used to create microvias with high precision.
- Sequential lamination: Layers are added one by one to create multi-layer PCBs.
- High-precision etching: To create fine traces and pads for smaller components.
- Plating: To ensure proper via filling and electrical conductivity.
- Automated Optical Inspection (AOI): For quality control and ensuring the integrity of small features.