RF PCBs
Engineered for High-Frequency Performance
Radio frequency (RF) circuits demand precision engineering where signal integrity determines system performance. High-frequency applications require specialized substrate materials, controlled impedance characteristics, and manufacturing processes that minimize insertion loss and phase distortion.
At HT Global Circuits, we specialize in RF PCB fabrication that delivers uncompromising signal integrity for mission-critical wireless applications. Our boards are designed to meet the exacting demands of high-frequency circuits where impedance control and low loss are paramount. As a leading RF PCB manufacturer with an extensive experience in custom RF microwave PCB solutions, we provide comprehensive fabrication services for frequencies ranging from DC to millimeter-wave applications.
RF PCB Capabilities
Our manufacturing capabilities span the complete range of RF technologies from traditional microwave circuits to emerging millimeter-wave systems.
| Specification | Capability |
|---|---|
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Frequency Range |
Supports DC to 77GHz+, enabling ultra-high-frequency applications. |
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Impedance Control |
±3% typical (±5% standard) for consistent signal integrity. |
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Layer Count |
2-20 layers, accommodating complex RF circuit designs. |
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Material Options |
Rogers, Taconic, Isola laminates, and mixed dielectric for tailored performance. |
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Trace Resolution
|
3 mil lines/spaces (2 mil available) for high-density RF layouts.
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Board Size
|
Up to 32″ x 52″ supporting large-scale RF PCB applications.
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Copper Weights
|
0.5 – 6 oz, providing flexibility for power and thermal requirements.
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Surface finishes
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HASL, Lead-free HASL, OSP, ENIG, Immersion tin, Immersion silver, for reliable connectivity and durability.
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Drill Capabilities |
4 mil minimum via diameter for precise and compact via structures. |
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Testing and Quality |
100% E-test, AOI, TDR validation to ensure high-quality RF performance. |
Certifications
Our production facilities produce in accordance with the IPC-A-600, IPC 6011 and IPC 6012 standards and have been awarded all the key certificates:
Beneficial Features of RF PCBs
We design RF PCBs to excel in high-frequency applications, offering distinct advantages over conventional digital boards due to transmission line effects at elevated frequencies. The following features are what make our RF PCBs indispensable for advanced applications:
High-Frequency Performance (DC to 77+ GHz)
Our RF circuit boards maintain consistent electrical characteristics across a broad frequency range, including mmWave. We use advanced substrates with stable dielectric constants to ensure predictable impedance behavior, minimal temperature coefficients, and consistent signal propagation delays for phase-matched systems.
Precision Impedance Control
Our RF PCBs are built to meet stringent impedance tolerances of ±5% for standard applications and ±3% for critical circuits. We ensure controlled dielectric thickness for impedance consistency, while optimizing copper surface roughness to reduce conductor losses at high frequencies.
Low-Loss Dielectric Materials
We choose high-performance RF substrates, including PTFE-based laminates that provide exceptional thermal stability and moisture resistance. With dissipation factors below 0.004 at microwave frequencies and glass transition temperatures exceeding 280°C, these materials guarantee reliable, long-term operation under demanding conditions.
Superior Signal Integrity
We optimize RF PCB designs to minimize crosstalk through precise trace spacing, ground planes, and via structures that maintain controlled impedance transitions. Proper shielding techniques ensure electromagnetic compatibility and prevent signal degradation in our designs.
Advanced Material Integration
We integrate multilayer RF PCB constructions using various performance-driven and cost-efficient materials. Critical signal layers are made from low-loss materials, while power distribution and thermal management layers balance heat dissipation and mechanical support.
Manufacturing Precision
During our high-speed RF PCB fabrication process, we maintain tight tolerances for trace width, layer registration, and hole positioning. Surface finish selection impacts insertion loss, while copper weight ensures proper current carrying capacity and skin depth management. We also ensure fine-feature capability with up to 3-mil traces for dense layouts.
Key Industries and Applications
RF PCBs are used across industries where wireless communication, sensing, and measurement systems require reliable high-frequency performance.
Each sector presents unique technical challenges that demand specialized materials and manufacturing approaches. We regularly deliver customized RF PCBs to the below industries, meeting their specific demands with precision and reliability.
- 5G and mmWave Infrastructure: We provide RF PCBs that support high-frequency telecommunications up to 77 GHz, enhancing data rates and reducing latency. These PCBs require precise phase matching for beamforming and low noise figures for base stations. Our designs integrate numerous RF channels in compact systems for massive MIMO applications.
- Aerospace and Defense Applications: Our aerospace RF PCBs are built to endure extreme conditions like temperature cycling and radiation. They are critical for systems such as phased array radar and satellite communications, ensuring high phase stability and long-term reliability. We also support electronic warfare systems with wide bandwidth and quick frequency shifts.
- Automotive Electronics: Our automotive RF PCBs enable advanced systems like radar sensors and vehicle-to-vehicle communication. We ensure compliance with strict regulatory standards for wireless systems like LIDAR and collision avoidance, while maintaining electromagnetic compatibility to prevent interference.
- IoT and Smart Device Integration: We design low-loss RF PCBs that enhance battery life in wireless sensors and support multi-band connectivity like Bluetooth and WiFi. Antenna integration helps reduce device size, and cost-effective manufacturing meets the demands of high-volume consumer electronics.
- Medical Device Applications: Our medical RF PCBs meet biocompatibility standards and regulatory requirements. They support precise power delivery in systems like RF ablation catheters and wireless patient monitoring. We focus on miniaturization for implantable devices while maintaining reliable communication.
Why Engineers Choose HT Global for RF PCBs?
Technical excellence in RF PCB manufacturing requires specialized knowledge, advanced equipment, and rigorous quality control processes. Our engineering-focused approach ensures consistent electrical performance while meeting demanding schedule and cost requirements.
- Material Expertise: We perform comprehensive qualification testing that validates dielectric properties across frequency, temperature, and humidity ranges for reliable design data. Direct relationships with substrate manufacturers provide access to the latest material developments and technical support. Material selection guidance balances electrical performance with thermal management and mechanical requirements for optimal system design.
- Controlled Impedance Precision: We use advanced test equipment to achieve impedance measurement accuracy within ±1 ohm for 50-ohm systems. Through statistical process control, we ensure impedance consistency across production lots. Our TDR analysis validates impedance profiles along trace lengths, identifying any discontinuities. We also conduct temperature coefficient testing to guarantee stable impedance across operational temperature ranges.
- Plated Through-Hole Quality: We ensure copper plating uniformity to maintain impedance consistency through via transitions, with less than 1% variation. Our aspect ratio capability extends to 12:1 for thick boards while preserving plating quality. We also offer via fill options that eliminate air gaps, preventing reliability issues in thermal cycling applications.
- Surface Finish Options: We use ENIG plating for flat surfaces that support fine-pitch components. The use of immersion silver finishes helps reduce insertion loss in high-frequency applications, provided proper handling procedures are followed. For cost-effective solutions, we offer OSP coating, which delivers adequate solderability for rapid assembly processes.
- RF Design and Engineering Support: We provide custom stackup development, signal integrity and impedance modeling, and DFM analysis to mitigate RF-specific layout risks. Our support spans prototype to production, optimizing designs for performance and manufacturability. This reduces rework, improves yield, and accelerates time-to-market. Engineers trust our expertise to deliver reliable, high-performance RF PCBs.
Get your PCBs Built – Fast
HT Global Circuits delivers quick-turn, high-quality PCBs with transparent pricing and reliable delivery. Order now to keep your projects on track.
Frequently Asked Questions
Our RF PCBs support DC to 77 GHz+ for mmWave applications like 5G and radar, using advanced materials and precision manufacturing. Performance is validated with network analyzer and TDR testing for consistent signal integrity.
We achieve ±3% impedance accuracy using electromagnetic modeling, precise manufacturing, and TDR testing. Statistical process control ensures consistency across varying design complexities and production batches.
We recommend Rogers RO4350B, RO4003C and Taconic substrates based on frequency, power, and environmental needs. Material selection optimizes dielectric properties, loss tangent, and cost for specific RF applications.
EMC is ensured through ground plane placement, via stitching, and isolation techniques. Testing includes near-field scanning and emission measurements to verify minimal interference.
We perform 100% E-test, AOI, impedance verification, and TDR, with network analyzer testing for loss and isolation. Statistical controls and documentation ensure performance and traceability.
We offer custom stackup design, electromagnetic simulation, signal integrity analysis, and DFM review. Support ensures performance, manufacturability, and cost optimization for RF applications.
We use hybrid stackups—low-loss materials only where needed, cutting your BOM by 30%.