MCPCB, Metal Core PCB, Thermal PCB

They are all aluminum boards which use a base metal material as the heat spreader portion of the circuit board.
Base metals in the MCPCB are used as an alternative to FR4 or standard boards for the ability to dissipate heat away from some board components and to less crucial areas such as the metal heatsink backing or metallic core.

Advantage of MCPCB

  1. Heat dissipation

Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.

  1. Thermal expansion

Thermal expansion and contraction is the common nature of the substance, different CTE is different in thermal expansion. As its own characteristics, aluminum and copper have unique advance than normal FR4, thermal conductivity can be 0.8~3.0 W/c.K.

  1. Dimensional stabilityIt is clear that the size of the metal-based printed circuit board more stable than insulating materials. The size change of 2.5 ~ 3.0% when Aluminum PCB and aluminum sandwich panels was heated from 30 ℃ to 140 ~ 150 ℃.

MCPCB

 

Application of MCPCB

 

LED lights :  High-current LED, Spotlight, high-current PCB

Industrial power equipment :
High-power transistors, transistor arrays, push-pull or totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-changing device (Inverter)

Cars : firing implement, power regulator, exchange converters, power controllers, variable optical system

Power : voltage regulator series, switching regulator, DC-DC converters

Audio : input – output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier

OA : Printer driver, large electronic display substrate, thermal print head

Others : Semiconductor thermal insulation board, IC arrays, resistor arrays, Ics carrier chip, heat sink, solar cell substrates, semiconductor refrigeration device

 

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