PRODUCTION CAPABILITY

Certifications

ISO 9001:2008

Yes

TS 16949

Yes

ISO 14001

Yes

RoHS Compliant

Yes

Other

Yes

Surface Finishes

HASL

3-25 um

HASL-Lead free

3-25 um

Immersion Tin

0,80-1,20 um

Immersion Silver

0,12-0,38 um

ENIG (immersion gold)

Ni:2-3,75um,0,05-1,20 um

OSP

<1um

Electrolytic Hard Gold
(Au thickness)

0,025-1,27um”

Electrolytic Soft Gold
(Au thickness)

0,025-1,20um

Electrolytic Gold For
Wire Bond

0,38-0,75um

Selective Finishes (More
than one finish)

ENIG/OSP/Immersion
Silver/HASL+Gold finger

Copper thickness

0.5-6oz

Yes

Other

specail 28 oz

Layers & Board
thickness

Single sided

0,1-8mm

Double sided

0,2-8mm

Multilayer

0,4-6mm

4 – 6 layer

0,4-6mm

8–12 layer

1-6mm

over 12 layer

1,4-6mm

Max.layer count-Flex

6

Max.layer count-Rigid /
Flex

6

Material Types

FR-4

Yes

Flex

Yes

Rigid / Flex

Yes

Teflon

F4B,Rogers,Taconic;Arlon

Ceramic

Rogers

Polyimide

yes

Hybrid

Rogers+FR-4;PTFE+FR-4

Aluminum

Bergquist & others

Minimum Line Width and
Spacing

3mil

Yes

Minimum Drilled Hole Size

Laser drilling

4 mil

CNC Drill

8 mil

Minimum Tolerances

PTH

+/-0,05 mm

NPTH

+/-0,05 mm

Outline-routed

+/-0,10 mm

Outline-scored

+/-0,15 mm

Scoring

20°, 30°, 45°, 60°
p>

Yes

Jump Scoring

Yes

Soldermask

Colors available

Green, black, white,
blue, yellow, red

Legend Print/Silkscreen

Colors available

White, yellow

Additional Process
Capabilities

Peelable Mask

Yes

max.diameter to tent with
peelable mask

3,0mm

max.peelable mask
thickness

0,40mm

Via hole filler
soldermask (100% fill)

Yes

Via hole filler
soldermask max.hole diameter

0,60mm

Conductive Hole Filler
(Silver/Copper)

Yes

Carbon Ink minimum
spacing

0,15mm

Half-hole plating

Yes

Edge Plating

Yes

min.hole wall plating
thickness

25um

Countersinks

90°

Bevelling

20°, 30°, 45°, 60°
p>

Controlled depth routing

Yes

Hard Gold Finger (Gold
thickness)

0,025 – 1,27 um

Blind Via Construction

Yes

Buried Via Construction

Yes

Via in pad

Yes

Controlled Impedance

Yes